Please use this identifier to cite or link to this item:
|Title:||Understanding nitrogen-induced effects on the performance of ultra low-k dielectric systems through ab initio simulations||Authors:||Dai, L.
|Issue Date:||15-Aug-2007||Citation:||Dai, L., Tan, V.B.C., Yang, S.-W., Wu, P., Chen, X.-T. (2007-08-15). Understanding nitrogen-induced effects on the performance of ultra low-k dielectric systems through ab initio simulations. Surface Science 601 (16) : 3366-3371. ScholarBank@NUS Repository. https://doi.org/10.1016/j.susc.2007.06.025||Abstract:||Large scale ab initio molecular dynamics simulations were performed to investigate how Cu/ultra low-k systems are improved when N is incorporated into the pore-sealing layers. It was found that the high affinity of N to Ta and H gives rise to new phases that prevent H atoms from penetrating the Ta diffusion barrier layer. Consequently, the Ta layer forms organized structures with good barrier performance and electrical conductivity. Furthermore, a continuous ductile film is formed to seal the highly porous polymer dielectrics. Interfacial adhesion between the pore-sealing layer and the dielectrics is also enhanced by inter-diffusion. © 2007 Elsevier B.V. All rights reserved.||Source Title:||Surface Science||URI:||http://scholarbank.nus.edu.sg/handle/10635/61644||ISSN:||00396028||DOI:||10.1016/j.susc.2007.06.025|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Feb 18, 2020
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.