Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/15/5/021
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dc.titleNumerical modeling of dielectrophoresis using a meshless approach
dc.contributor.authorChen, D.F.
dc.contributor.authorDu, H.
dc.contributor.authorLi, W.H.
dc.contributor.authorShu, C.
dc.date.accessioned2014-06-17T06:29:03Z
dc.date.available2014-06-17T06:29:03Z
dc.date.issued2005-05
dc.identifier.citationChen, D.F., Du, H., Li, W.H., Shu, C. (2005-05). Numerical modeling of dielectrophoresis using a meshless approach. Journal of Micromechanics and Microengineering 15 (5) : 1040-1048. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/15/5/021
dc.identifier.issn09601317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/60934
dc.description.abstractManipulation and separation of micro-sized particles, particularly in biological particles, using the dielectrophoretic (DEP) effect is an emerging application in MEMS technology. This paper presents a novel meshless numerical method - a weighted least square difference scheme, for solving electric fields and DEP forces generated by a typical interdigitated electrode array. Two cases were studied. First, a two-phase DEP interdigitated array was solved with the first-order approximate boundary condition and the exact boundary condition. The numerical results under these two conditions were compared. The numerical results under the approximate boundary condition were compared and verified with the analytical results obtained from the separation of variables method. The inaccuracy due to the approximate boundary condition was summarized. Second, a four-phase traveling wave DEP electrode array with the exact boundary condition was studied. The numerical results, including potential and twDEP forces, demonstrated that the modeling methodology is well suited for analysis of various DEP systems. © 2005 IOP Publishing Ltd.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1088/0960-1317/15/5/021
dc.description.sourcetitleJournal of Micromechanics and Microengineering
dc.description.volume15
dc.description.issue5
dc.description.page1040-1048
dc.description.codenJMMIE
dc.identifier.isiut000229565100021
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