Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.matlet.2005.10.090
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dc.titleFractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples
dc.contributor.authorJayaganthan, R.
dc.contributor.authorMohankumar, K.
dc.contributor.authorSekhar, V.N.
dc.contributor.authorTay, A.A.O.
dc.contributor.authorKripesh, V.
dc.date.accessioned2014-06-17T06:22:20Z
dc.date.available2014-06-17T06:22:20Z
dc.date.issued2006-04
dc.identifier.citationJayaganthan, R., Mohankumar, K., Sekhar, V.N., Tay, A.A.O., Kripesh, V. (2006-04). Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples. Materials Letters 60 (8) : 1089-1094. ScholarBank@NUS Repository. https://doi.org/10.1016/j.matlet.2005.10.090
dc.identifier.issn0167577X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/60362
dc.description.abstractThe Sn-Ag/Au/Ni-P/Cu, Sn-Ag-Bi/Au/Ni-P/Cu, and Sn-Ag-Cu/Au/Ni-P/Cu diffusion couples were prepared by reflowing the Pb free solders on the top surface metallization of the substrate at 250 °C. They were annealed at 150 and 170 °C for 4, 8, 16, 36, 45 days. The surface morphological features of intermetallic compounds (IMC) formed among the different elements in the solder alloys were characterized by Fractal Dimension using FE-SEM micrographs. The influence of processing parameters on morphological features was studied in the present work. The Box counting technique has been used to measure the fractal dimension of the IMC. It was observed that the morphology of the IMC varies from scallop to planar with increasing annealing time. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.matlet.2005.10.090
dc.sourceScopus
dc.subjectFractal dimension
dc.subjectIntermetallic compounds
dc.subjectPb-Free solders
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.matlet.2005.10.090
dc.description.sourcetitleMaterials Letters
dc.description.volume60
dc.description.issue8
dc.description.page1089-1094
dc.description.codenMLETD
dc.identifier.isiut000234951400024
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