Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.scriptamat.2008.08.020
DC FieldValue
dc.titleFatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
dc.contributor.authorSeah, S.K.W.
dc.contributor.authorWong, E.H.
dc.contributor.authorShim, V.P.W.
dc.date.accessioned2014-06-17T06:21:36Z
dc.date.available2014-06-17T06:21:36Z
dc.date.issued2008-12
dc.identifier.citationSeah, S.K.W., Wong, E.H., Shim, V.P.W. (2008-12). Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading. Scripta Materialia 59 (12) : 1239-1242. ScholarBank@NUS Repository. https://doi.org/10.1016/j.scriptamat.2008.08.020
dc.identifier.issn13596462
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/60301
dc.description.abstractThe fatigue crack growth in a solder joint was monitored during dynamic cyclic loading induced by mechanical shock. Crack growth was tracked via measurement of tiny resistance changes in the solder joint coupled with computational simulations of cracked joints. The unique fatigue characteristics observed are an insignificant crack nucleation period and a distinctive growth pattern for bulk solder cracks. Crack growth accelerates upon movement of the crack into intermetallic regions, a common occurrence for lead-free solders under high material strain rates. © 2008 Acta Materialia Inc.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.scriptamat.2008.08.020
dc.sourceScopus
dc.subjectDrop impact
dc.subjectElectronic packaging
dc.subjectFatigue crack propagation
dc.subjectLead-free solder
dc.subjectLow cycle fatigue
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.scriptamat.2008.08.020
dc.description.sourcetitleScripta Materialia
dc.description.volume59
dc.description.issue12
dc.description.page1239-1242
dc.description.codenSCMAF
dc.identifier.isiut000261007400003
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