Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.ijsolstr.2005.10.014
DC FieldValue
dc.titleEffects of pressure-sensitivity and plastic dilatancy on void growth and interaction
dc.contributor.authorChew, H.B.
dc.contributor.authorGuo, T.F.
dc.contributor.authorCheng, L.
dc.date.accessioned2014-06-17T06:19:25Z
dc.date.available2014-06-17T06:19:25Z
dc.date.issued2006-10
dc.identifier.citationChew, H.B., Guo, T.F., Cheng, L. (2006-10). Effects of pressure-sensitivity and plastic dilatancy on void growth and interaction. International Journal of Solids and Structures 43 (21) : 6380-6397. ScholarBank@NUS Repository. https://doi.org/10.1016/j.ijsolstr.2005.10.014
dc.identifier.issn00207683
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/60117
dc.description.abstractHydrostatic stress can affect the non-elastic deformation and flow stress of polymeric materials and certain metallic alloys. This sensitivity to hydrostatic stress can also influence the fracture toughness of ductile materials, which fail by void growth and coalescence. These materials typically contain a non-uniform distribution of voids of varying size-scales and void shapes. In this work, the effects of void shape and microvoid interaction in pressure-sensitive materials are examined via a two-prong approach: (i) an axisymmetric unit-cell containing a single ellipsoidal void and (ii) a plane-strain unit-cell consisting of a single large void and a population of discrete microvoids. The representative material volume in both cases is subjected to physical stress states similar to highly stressed regions ahead of a crack. Results show that oblate voids and microvoid cavitation can severely reduce the critical stress of the material. These effects can be compounded under high levels of pressure-sensitivity. In some cases, the critical stress responsible for rapid void growth is reduced to levels comparable to the yield strength of the material. The contribution of void shape and pressure-sensitivity to the thermal- and moisture-induced voiding phenomenon in IC packages is also discussed. © 2005 Elsevier Ltd. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.ijsolstr.2005.10.014
dc.sourceScopus
dc.subjectMicrovoids
dc.subjectPorous material
dc.subjectPressure-sensitive yielding
dc.subjectVoid growth
dc.subjectVoid shape
dc.typeArticle
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.ijsolstr.2005.10.014
dc.description.sourcetitleInternational Journal of Solids and Structures
dc.description.volume43
dc.description.issue21
dc.description.page6380-6397
dc.identifier.isiut000241223000004
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