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|Title:||Development of stretch solder interconnections for wafer level packaging||Authors:||Rajoo, R.
Solder joint reliability
Stretch solder interconnect
Wafer level packaging
|Issue Date:||May-2008||Citation:||Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2008-05). Development of stretch solder interconnections for wafer level packaging. IEEE Transactions on Advanced Packaging 31 (2) : 377-385. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.923390||Abstract:||A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps. © 2008 IEEE.||Source Title:||IEEE Transactions on Advanced Packaging||URI:||http://scholarbank.nus.edu.sg/handle/10635/59946||ISSN:||15213323||DOI:||10.1109/TADVP.2008.923390|
|Appears in Collections:||Staff Publications|
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