Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.1879312
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dc.titleAn optical shadowgraph microscope for a semiconductor wafer bump height measurement
dc.contributor.authorWang, S.
dc.contributor.authorQuan, C.
dc.contributor.authorTay, C.J.
dc.date.accessioned2014-06-17T06:12:13Z
dc.date.available2014-06-17T06:12:13Z
dc.date.issued2005-04
dc.identifier.citationWang, S., Quan, C., Tay, C.J. (2005-04). An optical shadowgraph microscope for a semiconductor wafer bump height measurement. Review of Scientific Instruments 76 (4) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1879312
dc.identifier.issn00346748
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/59504
dc.description.abstractWe describe an optical micro shadowgraph for measuring the height of a micro solderball on a semiconductor wafer. The proposed optical system consists of a white-light microscopic inclination illumination and a telecentric objective. The solderball shadow image resulting from a slant illumination onto the protruded bump/solderball on the wafer is clearly captured. In terms of geometrical optics, a formula is derived to resolve the bump height from the length of the resulting shadow on the wafer surface. Experimental results demonstrate that the bump height measurement can be readily implemented. © 2005 American Institute of Physics.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1063/1.1879312
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1063/1.1879312
dc.description.sourcetitleReview of Scientific Instruments
dc.description.volume76
dc.description.issue4
dc.description.page-
dc.description.codenRSINA
dc.identifier.isiut000228362200051
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