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Title: Inspection of micro-cracks on solderball surface using a laser scattering method
Authors: Quan, C. 
Wang, S.H. 
Tay, C.J. 
Shang, H.M. 
Chan, K.C.
Issue Date: 1-Sep-2000
Citation: Quan, C., Wang, S.H., Tay, C.J., Shang, H.M., Chan, K.C. (2000-09-01). Inspection of micro-cracks on solderball surface using a laser scattering method. Optics Communications 183 (1) : 19-27. ScholarBank@NUS Repository.
Abstract: This paper reports the potential of a non-contacting technique for detecting cracks on the surface of solderball. The technique is based on the light scattering method, which uses conventional optical components to focus light beam emitted from a low-power He-Ne laser onto the test surface. During inspection, the laser beam scans the test surface and when it encounters a surface defect, the scattered light intensity distribution will be changed - the change in the scattering characteristic is dependent of the defect size. Depending upon the size of laser spot on the test surface, two models for evaluating the defect size are discussed in this paper. Test results on specimens with crack size ranging from 4 μm to 60 μm have shown that the proposed technique is suitable for crack detection of solderball.
Source Title: Optics Communications
ISSN: 00304018
DOI: 10.1016/S0030-4018(00)00872-5
Appears in Collections:Staff Publications

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