Please use this identifier to cite or link to this item: https://doi.org/10.6113/JPE.2012.12.1.19
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dc.titleRealistic simulations on reverse junction characteristics of sic and GaN power semiconductor devices
dc.contributor.authorWei, G.
dc.contributor.authorLiang, Y.C.
dc.contributor.authorSamudra, G.S.
dc.date.accessioned2014-06-17T03:03:26Z
dc.date.available2014-06-17T03:03:26Z
dc.date.issued2012-01
dc.identifier.citationWei, G., Liang, Y.C., Samudra, G.S. (2012-01). Realistic simulations on reverse junction characteristics of sic and GaN power semiconductor devices. Journal of Power Electronics 12 (1) : 19-23. ScholarBank@NUS Repository. https://doi.org/10.6113/JPE.2012.12.1.19
dc.identifier.issn15982092
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/57198
dc.description.abstractThis paper presents a practical methodology for realistic simulation on reverse characteristics of Wide Bandgap (WBG) SiC and GaN p-n junctions. The adjustment on certain physic-based model parameters, such as the trap density and photo-generation for SiC junction, and impact ionization coefficients and critical field for GaN junction are described. The adjusted parameters were used in Synopsys Medici simulation to obtain a realistic p-n junction avalanche breakdown voltage. The simulation results were verified through benchmarking against independent data reported by others.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.6113/JPE.2012.12.1.19
dc.sourceScopus
dc.subjectHigh voltage p-n junction
dc.subjectSiC/GaN diode simulation
dc.subjectWBG power semiconductor
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.6113/JPE.2012.12.1.19
dc.description.sourcetitleJournal of Power Electronics
dc.description.volume12
dc.description.issue1
dc.description.page19-23
dc.identifier.isiut000303028000003
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