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|Title:||Equipment design and control of advanced thermal-processing module in lithography||Authors:||Tay, A.
|Issue Date:||Mar-2010||Citation:||Tay, A., Chua, H.T., Wang, Y., Ngo, Y.S. (2010-03). Equipment design and control of advanced thermal-processing module in lithography. IEEE Transactions on Industrial Electronics 57 (3) : 1112-1119. ScholarBank@NUS Repository. https://doi.org/10.1109/TIE.2009.2026230||Abstract:||A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. This design is an improvement of a previous work, eliminating the need of a mica heater. The system is designed via detailed modeling and simulations based on first-principle heat-transfer analysis. Experimental results on the prototype demonstrate about ± 0.4 °C spatial uniformity during the entire thermal cycle. © 2006 IEEE.||Source Title:||IEEE Transactions on Industrial Electronics||URI:||http://scholarbank.nus.edu.sg/handle/10635/55904||ISSN:||02780046||DOI:||10.1109/TIE.2009.2026230|
|Appears in Collections:||Staff Publications|
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