Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/22/10/105031
Title: Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms
Authors: Koh, K.H.
Qian, Y.
Lee, C. 
Issue Date: Oct-2012
Citation: Koh, K.H., Qian, Y., Lee, C. (2012-10). Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms. Journal of Micromechanics and Microengineering 22 (10) : -. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/22/10/105031
Abstract: By using a CMOS compatible process technology, a MEMS variable optical attenuator (VOA) is characterized in terms of actuation mechanisms. A dual-fiber collimator is aligned perpendicularly to the micromirror in a three-dimensional (3D) free space configuration, where the micromirror is mechanically connected with an electromagnetic actuator and two sets of electrothermal actuators. Three types of attenuation schemes based on electromagnetic, electrothermal and hybrid, i.e. combination of electrothermal and electromagnetic, actuations have been explored and studied. Dynamic attenuation ranges of 40dB have been achieved at 4Vdc, 26 mW and 3Vdc,20 mW by electromagnetic and electrothermal attenuation schemes respectively. Wavelength-dependent loss has been demonstrated to be less than 0.6dB at all attenuation states for both attenuation schemes. In the hybrid attenuation scheme, various voltage combinations are made to the electromagnetic and electrothermal actuators. An optical attenuation of approximately 40dB can be obtained when two volts are applied to both the electromagnetic and electrothermal actuators simultaneously, while the electrical power consumption of the actuators is 17 mW in total. Our unique design of using both electrothermal and electromagnetic actuators simultaneously to achieve attenuation is the first demonstration of such a hybrid-driven CMOS compatible MEMS VOA device. © 2012 IOP Publishing Ltd.
Source Title: Journal of Micromechanics and Microengineering
URI: http://scholarbank.nus.edu.sg/handle/10635/55536
ISSN: 09601317
DOI: 10.1088/0960-1317/22/10/105031
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