Please use this identifier to cite or link to this item:
|Title:||Automatic integrated circuit die positioning in the scanning electron microscope||Authors:||Tan, H.W.
Scanning electron microscopy
|Issue Date:||2002||Citation:||Tan, H.W.,Phang, J.C.H.,Thong, J.T.L. (2002). Automatic integrated circuit die positioning in the scanning electron microscope. Scanning 24 (2) : 86-91. ScholarBank@NUS Repository.||Abstract:||In scanning electron microscope (SEM)-based integrated circuit (IC) failure analysis, there is often a need for manual location of a prespecified failure site in several ICs. Such a procedure is both tedious and time consuming. This paper presents a new vision-based die positioning system that can automatically locate a specified failure site without the need for a high-accuracy specimen stage. Depending on the appearance of the desired failure site, the system applies either image registration or feature tracking to locate the site. Experiments performed on a variety of IC samples show that the system is able to locate the failure site accurately, even in the presence of unfavorable conditions such as IC sample rotation and repetitive IC patterns.||Source Title:||Scanning||URI:||http://scholarbank.nus.edu.sg/handle/10635/55169||ISSN:||01610457|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on May 21, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.