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Please use this identifier to cite or link to this item: https://doi.org/10.1155/2007/64589
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dc.titleA molecular dynamics study of the effect of voids on the deformation behavior of nanocrystalline copper
dc.contributor.authorZheng, C.
dc.contributor.authorZhang, Y.-W.
dc.date.accessioned2014-06-16T09:31:09Z
dc.date.available2014-06-16T09:31:09Z
dc.date.issued2007
dc.identifier.citationZheng, C., Zhang, Y.-W. (2007). A molecular dynamics study of the effect of voids on the deformation behavior of nanocrystalline copper. Journal of Nanomaterials 2007 : -. ScholarBank@NUS Repository. https://doi.org/10.1155/2007/64589
dc.identifier.issn16874110
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/54437
dc.description.abstractMolecular dynamics simulations are performed to study the effect of preexisting ellipsoidal voids on the tensile deformation behavior in nanocrystalline copper. No crack propagation is observed regardless of the orientation of the voids with respect to the tensile direction. However it is found that the voids may assist the shear plane formation via (1) emitting dislocations from the void tips, (2) relieving triple-junction confinement, and (3) catalyzing grain splitting.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.description.doi10.1155/2007/64589
dc.description.sourcetitleJournal of Nanomaterials
dc.description.volume2007
dc.description.page-
dc.identifier.isiut000252227100001
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