Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/20/6/065017
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dc.titleA MEMS rotary comb mechanism for harvesting the kinetic energy of planar vibrations
dc.contributor.authorYang, B.
dc.contributor.authorLee, C.
dc.contributor.authorKotlanka, R.K.
dc.contributor.authorXie, J.
dc.contributor.authorLim, S.P.
dc.date.accessioned2014-06-16T09:30:06Z
dc.date.available2014-06-16T09:30:06Z
dc.date.issued2010-06
dc.identifier.citationYang, B., Lee, C., Kotlanka, R.K., Xie, J., Lim, S.P. (2010-06). A MEMS rotary comb mechanism for harvesting the kinetic energy of planar vibrations. Journal of Micromechanics and Microengineering 20 (6) : -. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/20/6/065017
dc.identifier.issn09601317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/54342
dc.description.abstractA capacitive energy harvester based on in-plane rotary combs is proposed and studied. It is capable of collecting kinetic energy from planar ambient vibrations for low frequency operation. The design and simulation of capacitance among rotary combs, ladder spring and resonant frequency of the whole rotary comb energy harvester are presented in this paper. This device is fabricated in SOI (silicon-on-insulator) wafers by deep silicon etching technology. The dimensions of the prototype are about 7.5 mm × 7.5 mm × 0.7 mm. A maximum measured output power in air for vibrations of 0.5 g, 1 g, 1.5 g, 2 g and 2.5 g is 0.11 μW, 0.17 μW, 0.24 μW, 0.3 μW and 0.35 μW, respectively, when the loading resistance matches the parasitic resistance of 80MΩ at the resonant frequency of 110 Hz. In order to reduce the air damping effect, the prototype is packaged by having a metal cap to form the vacuum level of 3 Torr. The testing results in vacuum level of 3 Torr show that the resonant frequency decreases from 110 Hz in air to 63 Hz, and the maximum electrical output power at 0.25 g is 0.39 μW. © 2010 IOP Publishing Ltd.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1088/0960-1317/20/6/065017
dc.description.sourcetitleJournal of Micromechanics and Microengineering
dc.description.volume20
dc.description.issue6
dc.description.page-
dc.description.codenJMMIE
dc.identifier.isiut000278268200038
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