Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/20/11/115028
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dc.titleA high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique
dc.contributor.authorDu, Y.
dc.contributor.authorZhou, G.
dc.contributor.authorCheo, K.K.L.
dc.contributor.authorZhang, Q.
dc.contributor.authorFeng, H.
dc.contributor.authorChau, F.S.
dc.date.accessioned2014-06-16T09:29:11Z
dc.date.available2014-06-16T09:29:11Z
dc.date.issued2010-11
dc.identifier.citationDu, Y., Zhou, G., Cheo, K.K.L., Zhang, Q., Feng, H., Chau, F.S. (2010-11). A high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique. Journal of Micromechanics and Microengineering 20 (11) : -. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/20/11/115028
dc.identifier.issn09601317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/54253
dc.description.abstractA novel micro-electromechanical system (MEMS) technology-based grating laser scanner with a backside thinned grating platform has been successfully developed for high-speed laser scanning applications. The grating platform is thinned by a round cavity and reinforced by a circular frame, which are fabricated using a single mask delay etching (SMDE) technique. The SMDE technique, which utilizes the well-know loading effects of the deep reactive ion etching (DRIE) process, is a simple and low-cost methodology to regulate the etching rate of a prescribed area. It can be used in a silicon-on-insulator (SOI) micromachining process to form multilevel structures in a silicon device layer through a multi-step DRIE process from a wafer's backside. This paper presents the design, simulation, fabrication process and characterization of the high-speed MEMS grating scanner as well as the principle and applications of the SMDE technique. When illuminated with a 635 nm wavelength incident laser beam, the prototype scanner with a 1 mm diameter diffraction grating is capable of scanning at 50.192 kHz with an optical scan angle of 14.1°. © 2010 IOP Publishing Ltd.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1088/0960-1317/20/11/115028
dc.description.sourcetitleJournal of Micromechanics and Microengineering
dc.description.volume20
dc.description.issue11
dc.description.page-
dc.description.codenJMMIE
dc.identifier.isiut000283691600029
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