Please use this identifier to cite or link to this item:
https://doi.org/10.1088/0960-1317/20/11/115028
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dc.title | A high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique | |
dc.contributor.author | Du, Y. | |
dc.contributor.author | Zhou, G. | |
dc.contributor.author | Cheo, K.K.L. | |
dc.contributor.author | Zhang, Q. | |
dc.contributor.author | Feng, H. | |
dc.contributor.author | Chau, F.S. | |
dc.date.accessioned | 2014-06-16T09:29:11Z | |
dc.date.available | 2014-06-16T09:29:11Z | |
dc.date.issued | 2010-11 | |
dc.identifier.citation | Du, Y., Zhou, G., Cheo, K.K.L., Zhang, Q., Feng, H., Chau, F.S. (2010-11). A high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique. Journal of Micromechanics and Microengineering 20 (11) : -. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/20/11/115028 | |
dc.identifier.issn | 09601317 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/54253 | |
dc.description.abstract | A novel micro-electromechanical system (MEMS) technology-based grating laser scanner with a backside thinned grating platform has been successfully developed for high-speed laser scanning applications. The grating platform is thinned by a round cavity and reinforced by a circular frame, which are fabricated using a single mask delay etching (SMDE) technique. The SMDE technique, which utilizes the well-know loading effects of the deep reactive ion etching (DRIE) process, is a simple and low-cost methodology to regulate the etching rate of a prescribed area. It can be used in a silicon-on-insulator (SOI) micromachining process to form multilevel structures in a silicon device layer through a multi-step DRIE process from a wafer's backside. This paper presents the design, simulation, fabrication process and characterization of the high-speed MEMS grating scanner as well as the principle and applications of the SMDE technique. When illuminated with a 635 nm wavelength incident laser beam, the prototype scanner with a 1 mm diameter diffraction grating is capable of scanning at 50.192 kHz with an optical scan angle of 14.1°. © 2010 IOP Publishing Ltd. | |
dc.source | Scopus | |
dc.type | Article | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1088/0960-1317/20/11/115028 | |
dc.description.sourcetitle | Journal of Micromechanics and Microengineering | |
dc.description.volume | 20 | |
dc.description.issue | 11 | |
dc.description.page | - | |
dc.description.coden | JMMIE | |
dc.identifier.isiut | 000283691600029 | |
Appears in Collections: | Staff Publications |
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