Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.applthermaleng.2008.05.024
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dc.titleA heater plate assisted bake/chill system for photoresist processing in photolithography
dc.contributor.authorChua, H.T.
dc.contributor.authorTay, A.
dc.contributor.authorWang, Y.
dc.contributor.authorWu, X.
dc.date.accessioned2014-06-16T09:28:59Z
dc.date.available2014-06-16T09:28:59Z
dc.date.issued2009-04
dc.identifier.citationChua, H.T., Tay, A., Wang, Y., Wu, X. (2009-04). A heater plate assisted bake/chill system for photoresist processing in photolithography. Applied Thermal Engineering 29 (5-6) : 985-997. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2008.05.024
dc.identifier.issn13594311
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/54235
dc.description.abstractA thermal processing module, which consists of a dense distribution of multivariate controlled heat/chill elements, is developed to achieve temperature uniformity of a silicon wafer throughout the processing temperature cycle of ramp, hold and quench in microlithography. In the proposed unit, the bake and chill steps are conducted sequentially within the same module without any substrate movement. The unit includes two heating sources. The first is a mica heater which serves as the dominant means for heat transfer. The second is a set of thermoelectric devices (TEDs) which are used to provide a distributed amount of heat to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. The feasibility of a practical system is demonstrated via detailed modeling and simulations based on first principle heat transfer analysis. © 2008 Elsevier Ltd. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.applthermaleng.2008.05.024
dc.sourceScopus
dc.subjectLithography
dc.subjectMica heater
dc.subjectTemperature control
dc.subjectThermoelectric
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1016/j.applthermaleng.2008.05.024
dc.description.sourcetitleApplied Thermal Engineering
dc.description.volume29
dc.description.issue5-6
dc.description.page985-997
dc.description.codenATENF
dc.identifier.isiut000263608900024
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