Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2010.06.064
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dc.titleDiffusion induced columnar structure, high perpendicular anisotropy and low transformation temperature in thick FePt films
dc.contributor.authorThongmee, S.
dc.contributor.authorLiu, B.H.
dc.contributor.authorDing, J.
dc.contributor.authorYi, J.B.
dc.date.accessioned2014-05-16T07:02:42Z
dc.date.available2014-05-16T07:02:42Z
dc.date.issued2010-09-30
dc.identifier.citationThongmee, S., Liu, B.H., Ding, J., Yi, J.B. (2010-09-30). Diffusion induced columnar structure, high perpendicular anisotropy and low transformation temperature in thick FePt films. Thin Solid Films 518 (23) : 7053-7058. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2010.06.064
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/52609
dc.description.abstractThick FePt films (800 nm) were deposited by electroplating using Ag electrode. 2 at.% Ag doping into the electrolyte can lead to a columnar structure after annealing. The annealed film shows a high coercivity AR and perpendicular anisotropy. The additive of Ag can also significantly reduce fct-phase ordering temperature to 400 °C, comparing with an ordering temperature of 700 °C without Ag doping. The diffusion from Ag electrode and dopant is attributed to the formation of columnar structure, perpendicular anisotropy and reduced ordering temperature. © 2010 Elsevier B.V.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2010.06.064
dc.sourceScopus
dc.subjectElectrodeposition
dc.subjectFePt
dc.subjectHigh coercivity AR and diffusion
dc.subjectPerpendicular anisotropy
dc.typeArticle
dc.contributor.departmentCHEMISTRY
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.description.doi10.1016/j.tsf.2010.06.064
dc.description.sourcetitleThin Solid Films
dc.description.volume518
dc.description.issue23
dc.description.page7053-7058
dc.description.codenTHSFA
dc.identifier.isiut000282534000060
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