Please use this identifier to cite or link to this item: https://doi.org/10.1021/la048741r
DC FieldValue
dc.titleApplication of direct covalent molecular assembly in the fabrication of polyimide ultrathin films
dc.contributor.authorZhang, F.
dc.contributor.authorJia, Z.
dc.contributor.authorSrinivasan, M.P.
dc.date.accessioned2014-04-25T09:03:30Z
dc.date.available2014-04-25T09:03:30Z
dc.date.issued2005-04-12
dc.identifier.citationZhang, F., Jia, Z., Srinivasan, M.P. (2005-04-12). Application of direct covalent molecular assembly in the fabrication of polyimide ultrathin films. Langmuir 21 (8) : 3389-3395. ScholarBank@NUS Repository. https://doi.org/10.1021/la048741r
dc.identifier.issn07437463
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/51755
dc.description.abstractUltrathin films were fabricated using synthesized hydroxyl polyimide (HPI) in a layer-by-layer fashion on amine-terminated substrates of silicon, quartz, and gold. The interlayer linkages were established by using terephthaloyl chloride as a bridging agent to form ester groups between HPI layers. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, UV-vis absorption spectroscopy, atomic force microscopy, ellipsometry, and electrochemical impedance spectroscopy were employed to study the interfacial chemistry, stepwise growth, morphology, thickness, optical property, and insulation behavior of the assembled film. The films show excellent stability and strength, which can be attributed to the covalent interlayer linkage. © 2005 American Chemical Society.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1021/la048741r
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentCHEMICAL & BIOMOLECULAR ENGINEERING
dc.contributor.departmentPHYSICS
dc.description.doi10.1021/la048741r
dc.description.sourcetitleLangmuir
dc.description.volume21
dc.description.issue8
dc.description.page3389-3395
dc.description.codenLANGD
dc.identifier.isiut000228218700028
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