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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/51558
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dc.titleAdvanced ELID process development for grinding silicon wafers
dc.contributor.authorIslam, M.M.
dc.contributor.authorSenthil Kumar, A.
dc.contributor.authorBalakumar, S.
dc.contributor.authorLim, H.S.
dc.contributor.authorRahman, M.
dc.date.accessioned2014-04-24T10:15:07Z
dc.date.available2014-04-24T10:15:07Z
dc.date.issued2005
dc.identifier.citationIslam, M.M.,Senthil Kumar, A.,Balakumar, S.,Lim, H.S.,Rahman, M. (2005). Advanced ELID process development for grinding silicon wafers. Materials Research Society Symposium Proceedings 867 : 97-104. ScholarBank@NUS Repository.
dc.identifier.issn02729172
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/51558
dc.description.abstractA completely new and novel electrolytic system, Injection Electrode (IE) assisted electrolysis, has been tried here to improve the quality of the silicon wafer surfaces generated by Electrolytic In-process Dressing (ELID) grinding process. The Experiments were conducted by varying the injection flow rate in order to perform extensive analysis on the effect of injection flow rate on the generated wheel surface condition and the consequent grinding performance. Experimental results showed that lower injection flow rate greatly improved the wheel surface condition resulting in superior ground surface qualities. © 2005 Materials Research Society.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentTROPICAL MARINE SCIENCE INSTITUTE
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleMaterials Research Society Symposium Proceedings
dc.description.volume867
dc.description.page97-104
dc.description.codenMRSPD
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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