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Title: Post-cure shrinkage of photo-sensitive material used in laser lithography process
Authors: Fuh, J.Y.H. 
Chooo, Y.S. 
Lu, L. 
Nee, A.Y.C. 
Wong, Y.S. 
Wang, W.L. 
Miyazawa, T. 
Ho, S.H.
Keywords: Laser lithography
Thermal curing
UV curing
Issue Date: Jan-1997
Citation: Fuh, J.Y.H.,Chooo, Y.S.,Lu, L.,Nee, A.Y.C.,Wong, Y.S.,Wang, W.L.,Miyazawa, T.,Ho, S.H. (1997-01). Post-cure shrinkage of photo-sensitive material used in laser lithography process. Journal of Materials Processing Technology 63 (1-3) : 887-891. ScholarBank@NUS Repository.
Abstract: Shrinkage causes distortion and warpage due to the internal stresses built up during fabrication, and greatly influences the dimensional accuracy of a part. This paper presents an experimental study on the relationships between the key parameters of the laser lithography (LL) (or commonly known as Stereolithography) process and the resulting post-curing shrinkage due to thermal and ultraviolet (UV) exposure. The UV-sensitive material used in the experiment is an acrylic-based resin, namely SCR-310. The post-curing process causes partially-cured and uncured resin to be further polymerised and is necessary for the improvement of the final mechanical properties of the parts. In principle, a larger laser power or a smaller layer pitch will result in a smaller amount of partially-cured or uncured resin, with less shrinkage after post-curing. A better understanding of the behaviour and characterisation of the shrinkage process during thermal and UV treatments will help to reduce the post-cure distortion, and will lead to more accurate rapid prototypes produced by the LL process. The origin of shrinkage from photo-polymerisation is closely examined through the measurements along both the scanning and transversal directions.
Source Title: Journal of Materials Processing Technology
ISSN: 09240136
Appears in Collections:Staff Publications

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