Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/48563
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dc.titleDESIGN AND ANALYSIS OF ANTENNA-ON-CHIP AND ANTENNA-IN-PACKAGE FOR 60-GHZ WIRELESS COMMUNICATIONS
dc.contributor.authorBAO XIAOYUE
dc.date.accessioned2013-12-13T18:00:06Z
dc.date.available2013-12-13T18:00:06Z
dc.date.issued2013-08-01
dc.identifier.citationBAO XIAOYUE (2013-08-01). DESIGN AND ANALYSIS OF ANTENNA-ON-CHIP AND ANTENNA-IN-PACKAGE FOR 60-GHZ WIRELESS COMMUNICATIONS. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/48563
dc.description.abstractThe primary objective of this study is to design and analyze novel antennas-on-chip and antennas-in-package suitable for mm-Wave radio frequency wireless communications. By combining the novel metamaterial structure and folding 3-D Butler Matrix feeding network, a series of high-performance chip-level antenna and package-level antenna arrays, which can be further integrated into 60-GHz wireless systems, have been realized, analyzed, fabricated and measured.
dc.language.isoen
dc.subject60-GHz, Wireless Communications, Antenna-on-Chip, Antenna-in-Package, CMOS, LTCC
dc.typeThesis
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.contributor.supervisorGUO YONGXIN
dc.description.degreePh.D
dc.description.degreeconferredDOCTOR OF PHILOSOPHY
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Ph.D Theses (Open)

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