Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/35495
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dc.titleULTRA LOW STRESS METHOD FOR EPOXY RESINS: STRESS-TRANSFER
dc.contributorNATIONAL UNIVERSITY OF SINGAPORE
dc.contributor.authorSIOW, KOK, SIONG
dc.contributor.authorWANG, HONGBING
dc.contributor.authorXIE, HONG
dc.date.accessioned2012-11-21T08:58:48Z
dc.date.available2012-11-21T08:58:48Z
dc.date.issued1999-05-27
dc.identifier.citationSIOW, KOK, SIONG,WANG, HONGBING,XIE, HONG (1999-05-27). ULTRA LOW STRESS METHOD FOR EPOXY RESINS: STRESS-TRANSFER. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/35495
dc.description.abstractA method based on a new concept of stress-transfer for reducing the interfacial residual stress in epoxy resins by using a unique type of modifiers is described. The modifiers used must have a continuous or semi-continuous structure (i.e., a non-particle structure) such as sheet, film, plate, etc. The modifiers are prepared from the following materials: metals, ceramic materials or thermoplastic polymers, etc, with or without a surface coating with elastomers. The method is able to reduce the stress in the resins to an ultra low level, i.e., to a near zero or zero level, without compromising other important properties of the resins such as the good process flow property, adhesion strength and gelation time, etc. It can also be applied in a controllable way, i.e., to reduce the interfacial residual stress in epoxy resins to different levels. The method is also useful for reducing residual stress in other polymers, compositions and resins.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/http://analytics.patsnap.com/patent_view/view?pn=WO1999025769A1
dc.sourcePatSnap
dc.typePatent
dc.contributor.departmentCHEMISTRY
dc.identifier.isiutNOT_IN_WOS
dc.description.patentnoWO1999025769A1
dc.description.patenttypePublished Application
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