Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/34871
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dc.titleWAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
dc.contributorNATIONAL UNIVERSITY OF SINGAPORE
dc.contributorAGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
dc.contributor.authorLU, HAIJING
dc.contributor.authorGONG, HAO
dc.contributor.authorWONG, CHEE KHUEN STEPHEN
dc.date.accessioned2012-10-05T06:01:42Z
dc.date.available2012-10-05T06:01:42Z
dc.date.issued2005-03-09
dc.identifier.citationLU, HAIJING,GONG, HAO,WONG, CHEE KHUEN STEPHEN (2005-03-09). WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/34871
dc.description.abstractA process is used to produce copper bumps on a semiconductor chip or a wafer containing several microchips. The chip or wafer has a layer incorporating a plurality semiconductor devices and a passivation layer having openings. Conductive pads within the openings are in contact with the semiconductor devices. In the process, a conductive adhesive material is deposited onto the conductive pads to form adhesion layers. A conductive metal is deposited onto the adhesion layers to form barrier layers and the passivation layer is subjected to an acid dip solution to remove particles of the conductive adhesive material which can be attached to the passivation layer. Copper is then deposited onto the barrier layers to form the copper bump. Each one of the deposition steps are performed electrolessly. Furthermore, plating solutions and a wafer and a microchip produced by the above process and are provided.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/http://analytics.patsnap.com/patent_view/view?pn=EP1512173A1
dc.sourcePatSnap
dc.typePatent
dc.contributor.departmentMATERIALS SCIENCE
dc.identifier.isiutNOT_IN_WOS
dc.description.patentnoEP1512173A1
dc.description.patenttypePublished Application
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