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Title: Self Assembly of Organic Inhibitors for Copper Corrosion Inhibition
Authors: NG SU PENG
Keywords: organic, inhibitors, copper, corrosion, self, assembly
Issue Date: 29-Sep-2010
Citation: NG SU PENG (2010-09-29). Self Assembly of Organic Inhibitors for Copper Corrosion Inhibition. ScholarBank@NUS Repository.
Abstract: This project focuses on copper corrosion inhibition using self-assembled multilayer organic thin films. Multilayers composed of polymeric or monomeric inhibitors were used and the idea was built on the work of other research groups who used only a single monolayer of inhibitors. The aim of this project was to surpass the current inhibition efficiency offered by current monolayers of inhibitors through the multilayers. Main characterization techniques such as Atomic Force Microscopy (AFM), Electrochemical Impedance Spectroscopy (EIS) and X-Ray Photoelectrons Spectroscopy (XPS) were used to detect the presence of each organic film layer that makes up the multilayer structure and to assess the inhibition efficiency. Several factors affect the overall uniformity, hydrophobicity and extent of organic coupling which in turn affect the inhibition efficiency of the organic corrosion inhibitor layers. These factors include the type of solvent used, concentration of inhibitors, type of inhibitors, and duration of deposition. For example, the first layer of inhibitors were chosen with head groups that could bind strongly with copper and terminal groups free for organic coupling with subsequent inhibitors deposition. Besides the optimisation of the experimental procedures to obtain quality inhibitor films, concerns pertaining to the reactivity of copper are addressed through careful selection of solvents and design of processing steps. For instance, the solvent was selected based on the minimum reactivity with copper. The second layer of inhibitor consists of reactive terminal groups that could couple with the first inhibitor layer and a subsequent capping layer. Finally, a capping layer was used to couple with any remaining uncoupled reactive groups of the second layer. While it is important for organic inhibitors to adhere strongly to the copper surface, it is also equally important to ensure that these inhibitors are easily removed without leaving behind organic residues when protection is no longer required. There are no industrial methodologies currently developed to remove inhibitor molecules from copper surface though several methods have been developed for other metal surfaces. Two methods were thus developed, based on the application of heat to desorb the molecules from copper surface as well as a stripping bath method based on a method used for removing inhibitors from steel surface. The components of the bath were adjusted to be mild on copper surface. Characterization techniques were used to determine the efficacy of the two proposed techniques.
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