Mechanism-based modeling of ductile void growth failure in multilayer structures

Abstract

Inspiration for the present work comes from developments in the field of electronic packaging. Motivated by the moisture-induced a??popcorn crackinga?? failure phenomenon in the IC packages, this literature serves to gain a deeper understanding on the micro-mechanics of vapour pressure-assisted ductile fracture. IC packages assembly typically consists of intricate multilayer structures with polymeric matrix composites constituents, e.g. glass fiber and Ag-filled epoxy. Research areas thus investigates on the role of vapour pressure on fracture toughness of SSY crack growth and constrained ductile layer centerline crack growth models, together with decohesion failure at fiber-matrix and particle-matrix interfaces in ploymeric matrix composite.