DEVELOPMENT OF A WIDEBAND CIRCULARLY POLARISED FOWLP ANTENNA IN PACKAGE

Abstract

This paper presents a wideband circularly-polarized Antenna-in-Package (AiP) element implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for satellite communication. The AiP element features a meta-surface radiator with a single-ended aperture coupled feeding structure to achieve a wideband and circular polarization performance. By stacking a top mold of 500μm, a middle mold of 90μm and a 42μm RDL layer at the bottom, with a size of 10 mm×10 mm×0.652 mm, the AiP element achieves a Return Loss > 17.95 dB, an Axial Ratio < 2.67 dB, and a Gain of 7.19-7.88 dBi over 27–31 GHz. The antenna design concept is further confirmed using printed circuit board (PCB) technology for fast prototyping and evaluation.