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https://scholarbank.nus.edu.sg/handle/10635/248140
DC Field | Value | |
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dc.title | DEVELOPMENT OF A WIDEBAND CIRCULARLY POLARISED FOWLP ANTENNA IN PACKAGE | |
dc.contributor.author | ZHENG KAIBO | |
dc.date.accessioned | 2024-04-30T18:00:34Z | |
dc.date.available | 2024-04-30T18:00:34Z | |
dc.date.issued | 2024-01-12 | |
dc.identifier.citation | ZHENG KAIBO (2024-01-12). DEVELOPMENT OF A WIDEBAND CIRCULARLY POLARISED FOWLP ANTENNA IN PACKAGE. ScholarBank@NUS Repository. | |
dc.identifier.uri | https://scholarbank.nus.edu.sg/handle/10635/248140 | |
dc.description.abstract | This paper presents a wideband circularly-polarized Antenna-in-Package (AiP) element implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for satellite communication. The AiP element features a meta-surface radiator with a single-ended aperture coupled feeding structure to achieve a wideband and circular polarization performance. By stacking a top mold of 500μm, a middle mold of 90μm and a 42μm RDL layer at the bottom, with a size of 10 mm×10 mm×0.652 mm, the AiP element achieves a Return Loss > 17.95 dB, an Axial Ratio < 2.67 dB, and a Gain of 7.19-7.88 dBi over 27–31 GHz. The antenna design concept is further confirmed using printed circuit board (PCB) technology for fast prototyping and evaluation. | |
dc.language.iso | en | |
dc.subject | circularly polarized antenna , wideband antenna , FOWLP , Wafer Level Packaging , SOTM , Antenna-in-Package , Meta-surface | |
dc.type | Thesis | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.contributor.supervisor | Yongxin Guo | |
dc.contributor.supervisor | SUN MEI | |
dc.description.degree | Master's | |
dc.description.degreeconferred | MASTER OF ENGINEERING (CDE) | |
dc.identifier.orcid | 0009-0009-0144-7721 | |
Appears in Collections: | Master's Theses (Open) |
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File | Description | Size | Format | Access Settings | Version | |
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Thesis_zhengkaibo_2024.pdf | 3.96 MB | Adobe PDF | OPEN | None | View/Download |
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