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|Title:||TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA||Authors:||GE YEYANRAN||Keywords:||Anti-dumping sanctions,U.S.–China trade conflict,learning-by-exporting,innovation, patents||Issue Date:||1-Aug-2022||Citation:||GE YEYANRAN (2022-08-01). TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA. ScholarBank@NUS Repository.||URI:||https://scholarbank.nus.edu.sg/handle/10635/235597|
|Appears in Collections:||Ph.D Theses (Closed)|
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