Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/235597
Title: TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
Authors: GE YEYANRAN
Keywords: Anti-dumping sanctions,U.S.–China trade conflict,learning-by-exporting,innovation, patents
Issue Date: 1-Aug-2022
Citation: GE YEYANRAN (2022-08-01). TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA. ScholarBank@NUS Repository.
URI: https://scholarbank.nus.edu.sg/handle/10635/235597
Appears in Collections:Ph.D Theses (Closed)

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