Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/222030
Title: THE POTENTIAL OF 3D PRINTED RESIN MODEL WITH MICROENCAPSULATED PHASE CHANGE MATERIAL TO CREATE A MATERIAL WITH GOOD THERMAL PROPERTIES FOR BUILDINGS
Authors: LEE JIA JIN AMANDA
Keywords: Building
PFM
Project and Facilities Management
2019/2020 PFM
Shah Kwok Wei
Additive Manufacturing
Three Dimensional Printing
Resin
Phase Change Material
Microencapsulation
Thermal Conductivity
Thermal Energy Storage
Thermal Comfort
Buildings
Construction
Issue Date: 4-Jun-2020
Citation: LEE JIA JIN AMANDA (2020-06-04). THE POTENTIAL OF 3D PRINTED RESIN MODEL WITH MICROENCAPSULATED PHASE CHANGE MATERIAL TO CREATE A MATERIAL WITH GOOD THERMAL PROPERTIES FOR BUILDINGS. ScholarBank@NUS Repository.
Abstract: Heating, ventilation and air-conditioning (HVAC) systems are one of the biggest consumers of energy for buildings. As the number of consumers of air-conditioning is expected to increase, this would in turn create a rise in global demand for energy that may exceed the global supply. Hence, alternative methods of cooling that are more energy efficient, for instance the use of phase change material (PCM), has to be explored. PCM is a type of latent heat storage material that is able to store and release large amounts of energy in comparison to sensible heat storage. To make PCM usable in buildings, it has to be contained or encapsulated. Another area of exploration in this thesis is the potential of advanced construction techniques such as 3D printing. The utilisation of 3D printing in the construction industry has been gaining much popularity due to their ability to save time, effort and material as compared to conventional construction methods. Tying both PCM and 3D printing of construction elements together, the benefits of both elements would create a building material that is thermally efficient and yet easy to produce. Hence, the main focus of this thesis is to analyse the effectiveness of microencapsulated PCM (MPCM) with potential 3D printed building applications and possibly incorporate them into buildings for passive or active cooling. In this study, microencapsulated n-eicosane PCM of different percentage weightage (% wt.) was incorporated into 3D printed resin models and its respective thermal conductivities were studied. Results showed that the higher the % wt. of PCM in the resin-PCM model, the lower the thermal conductivity. Therefore, the incorporation of MPCM into resin demonstrates its potential in improving the thermal insulation of buildings.
URI: https://scholarbank.nus.edu.sg/handle/10635/222030
Appears in Collections:Bachelor's Theses

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