Electrical performance analysis of high-speed interconnects and circuits by numerical modeling methods

Abstract

Accurate electromagnetic modeling of high-speed interconnects and multilayer circuits together with efficient simulation of mixed electromagnetic and circuit problems plays an important role in modern circuit design and analysis. An accurate and systematic FDTD-macromodeling approach for signal integrity analysis of high-speed interconnects is implemented, which integrates the FDTD method and the macromodeling approach with the SPICE circuit simulator. It can account for the high-speed interconnect effects successfully, and greatly enhance the flexibility of analyzing mixed electromagnetic and circuit problems using the SPICE simulator. Furthermore, a new hybrid FDTD-MPIE method is proposed to efficiently analyze multilayer circuits with locally inhomogeneous objects. Both the numerical integration and DCIM methods are employed to evaluate multilayer Greena??s functions due to general sources. Numerical results demonstrate that the hybrid method using the iterative solution approach is accurate, fast and memory efficient.