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Title: Characterization and testing of nanofluid cooling technology for electronic systems
Keywords: Nanofluid, Thermal Conductivity, Microchannel Heat Sink, Thermal Contact Resistance, Electronics Cooling
Issue Date: 28-May-2005
Citation: XUE ZHENGJUN (2005-05-28). Characterization and testing of nanofluid cooling technology for electronic systems. ScholarBank@NUS Repository.
Abstract: A Nanofluid is an innovative type of highly efficient heat transfer fluid, which was made by dispersing nanometer-sized metallic or non-metallic particles in various base fluids. With their superior thermal properties, nanofluids are expected to be a promising coolant candidate for thermal management systems of next generation high heat dissipation electronic systems.In this research, one apparatus for thermal conductivity measurement using the steady-state parallel-plate method was fabricated. Nanofluids with different nanoparticle-base fluid combinations and different nanoparticle volumetric fractions were calibrated. A microchannel heat sink (MCHS) liquid cooling test rig was used to investigate the thermal performance improvement of nanofluid-cooled liquid cooling systems. The thermal performance of the MCHS cooling system was measured and calculated in terms of junction-to-inlet and heatsink base-to-inlet thermal resistances. Thermal resistances and pressure drop across the MCHS with different working fluids under different flowrates ranging from 0.1 L/min to 0.8 L/min were measured and compared. Moreover, numerical simulations were conducted to evaluate the convective heat transfer enhancement of nanofluids within and beyond the range of the current experiments.
Appears in Collections:Master's Theses (Open)

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