Please use this identifier to cite or link to this item: https://doi.org/10.1145/3294109.3295624
Title: WindyWall: Exploring Creative Wind Simulations
Authors: Tolley, David 
Thi, Ngoc Tram Nguyen 
Tang, Anthony 
Ranasinghe, Nimesha 
Kawauchi, Kensaku 
Yen, Ching-Chiuan 
Keywords: Science & Technology
Technology
Computer Science, Hardware & Architecture
Engineering, Electrical & Electronic
Computer Science
Engineering
Multimodal Interaction
Novel Actuators/Displays
Tactile/Haptic Interaction
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Issue Date: 1-Jan-2019
Publisher: ASSOC COMPUTING MACHINERY
Citation: Tolley, David, Thi, Ngoc Tram Nguyen, Tang, Anthony, Ranasinghe, Nimesha, Kawauchi, Kensaku, Yen, Ching-Chiuan (2019-01-01). WindyWall: Exploring Creative Wind Simulations. 13th International Conference on Tangible, Embedded, and Embodied Interaction (ACM TEI) : 635-644. ScholarBank@NUS Repository. https://doi.org/10.1145/3294109.3295624
Abstract: © 2019 Copyright is held by the owner/author(s). Publication rights licensed to ACM. Wind simulations are typically one-off implementations for specific applications. We introduce WindyWall, a platform for creative design and exploration of wind simulations. WindyWall is a three-panel 90-fan array that encapsulates users with 270° of wind coverage. We describe the design and implementation of the array panels, discussing how the panels can be re-arranged, where various wind simulations can be realized as simple effects. To understand how people perceive “wind” generated from WindyWall, we conducted a pilot study of wind magnitude perception using different wind activation patterns from WindyWall. Our findings suggest that: horizontal wind activations are perceived more readily than vertical ones, and that people's perceptions of wind are highly variable-most individuals will rate airflow differently in subsequent exposures. Based on our findings, we discuss the importance of developing a method for characterizing wind simulations, and provide design directions for others using fan arrays to simulate wind.
Source Title: 13th International Conference on Tangible, Embedded, and Embodied Interaction (ACM TEI)
URI: https://scholarbank.nus.edu.sg/handle/10635/169659
ISBN: 9781450361965
DOI: 10.1145/3294109.3295624
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