Please use this identifier to cite or link to this item: https://doi.org/10.1149/2.0141808jss
Title: The effect of hydrogen doping on the electrochemical etching of ion/irradiated n/type silicon
Authors: Liang, H.D. 
Breese, M.B.H. 
Duttagupta, S. 
Aberle, A.G. 
Bettiol, A.A. 
Venkatesan, T. 
Issue Date: 1-Apr-2018
Publisher: Electrochemical Society Inc.
Citation: Liang, H.D., Breese, M.B.H., Duttagupta, S., Aberle, A.G., Bettiol, A.A., Venkatesan, T. (2018-04-01). The effect of hydrogen doping on the electrochemical etching of ion/irradiated n/type silicon. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 7 (8) : N110-N113. ScholarBank@NUS Repository. https://doi.org/10.1149/2.0141808jss
Abstract: We have developed a model to account for the effects of MeV proton irradiation and annealing on the doping profile of crystalline n-type silicon, and how this alters the formation of porous silicon during subsequent electrochemical anodization. Based on this model, we have developed a machining process using MeV proton irradiation. The hydrogen-doping during irradiation in n-type silicon allows selective modification of the doping profile only at the ion end-of-range. This allows formation of buried, hollow channels in porous silicon without any influence of the defect profile introduced above this region, which limits this process in p-type silicon. © 2018 The Electrochemical Society.
Source Title: ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
URI: https://scholarbank.nus.edu.sg/handle/10635/168594
ISSN: 21628769
DOI: 10.1149/2.0141808jss
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