Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.nimb.2016.12.025
Title: High aspect ratio channels in glass and porous silicon
Authors: H.D. Liang 
Z.Y. Dang
J.F. Wu
J.A. van Kan 
S. Qureshi
M.D. Ynsa
V. Torres-Costa
A. Maira
T.V. Venkatesan 
M.B.H. Breese 
Keywords: Proton beam irradiation
High-aspect-ratio channel
Porous silicon
Issue Date: 1-Mar-2017
Publisher: Elsevier Ltd
Citation: H.D. Liang, Z.Y. Dang, J.F. Wu, J.A. van Kan, S. Qureshi, M.D. Ynsa, V. Torres-Costa, A. Maira, T.V. Venkatesan, M.B.H. Breese (2017-03-01). High aspect ratio channels in glass and porous silicon. NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION B B394. ScholarBank@NUS Repository. https://doi.org/10.1016/j.nimb.2016.12.025
Abstract: We have developed a micromachining process to produce high-aspect-ratio channels and holes in glass and porous silicon. Our process utilizes MeV proton beam irradiation of silicon using direct writing with a focused beam, followed by electrochemical etching. To increase throughput we have also developed another process for large area ion irradiation based on a radiation-resistant gold surface mask, allowing many square inches to be patterned. We present a study of the achievable channel width, depth and period and sidewall verticality for a range of channels which can be over 100 lm deep or 100 nm wide with aspect ratios up to 80. This process overcomes the difficulty of machining glass on a micro- and nanometer scale which has limited many areas of applications in different fields such as microelectronics and microfluidics.
Source Title: NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION B
URI: https://scholarbank.nus.edu.sg/handle/10635/168567
ISSN: 0168583X
DOI: 10.1016/j.nimb.2016.12.025
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