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|Title:||Ultra thin films of Oligoimide, polyimide and polyimide composites on amine-terminated substrates through covalent molecular assembly||Authors:||ZHANG FENGXIANG||Keywords:||aminosilane, layer-by-layer, covalent, polyimide, polythiophene-3-acetic acid, gold nanoparticle||Issue Date:||30-Aug-2006||Citation:||ZHANG FENGXIANG (2006-08-30). Ultra thin films of Oligoimide, polyimide and polyimide composites on amine-terminated substrates through covalent molecular assembly. ScholarBank@NUS Repository.||Abstract:||Formation of ultrathin films of oligoimide, polyimide (PI) and functional PI composites by direct covalent layer-by-layer (LBL) assembly was investigated in this project. Molecular assembly of 3-aminopropyltrimethoxysilane (APS) and p-aminophenyltrimethoxysilane (APhS) (which served as the derivatizing agents) on SiO2 surfaces was investigated first to optimize their performance as substrates for film construction. Ultrathin oligoimide films were fabricated through alternate assembly of pyromellitic dianhydride and diaminodiphenylether on APhS substrates, followed by thermal imidization. Ultrathin films composed entirely of polyimide were obtained from direct covalent LBL assembly of a synthesized hydroxyl polyimide (HPI), with interlayer linkages established by using terephthaloyl chloride as a bridging agent to form ester groups. Such PI films exhibited good stabilities and mechanical robustness. Direct covalent LBL assembly between preformed HPI and polythiophene acetic acid (PTAA) yielded composite polyimide films with reduced surface resistivity and good stability. The effectiveness of the technique is also established through LBL assembly between amino poly (amic acid) and naked gold nanoparticle (AuNP). They are bound together through a combined effect of covalent bonding and electrostatic interaction.||URI:||http://scholarbank.nus.edu.sg/handle/10635/15585|
|Appears in Collections:||Ph.D Theses (Open)|
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