CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING

Abstract

Carbon nanotubes (CNTs) as one-dimensional nano-scale materials have significant scientific and industrial values. The small dimensions, strength and the remarkable physical properties of these structures make them a very unique material with a whole range of promising applications. Early studies have been focused on its electrical, mechanical and thermal properties, as well as fabrication techniques. The first demonstration of CNT field effect transistor in 1998 opened its opportunities in microelectronics industry. It has also been proposed as one of the options to replace copper interconnection when FETs are further scaled down. As bulk materials, CNTs, functionalized CNTs or CNT filled composites have application in sensors, conductive adhesives, thermal enhancement materials, etc. The first half of the project involves a thorough review of literatures focusing on CNTs properties, fabrication methods and applications integrated circuit packaging. Later part of the project focuses on application of CNT in solder joint reliability enhancement. Specifically, process flow design, mask design and CNT growth have been carried out and preliminary result looks very promising to serve the objective. Proposals of CNTs in adhesives, molding compounds, via fillings are also presented.