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|Title:||IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING||Authors:||ARUN KUMAR SESURAJ||Keywords:||SAC (SnAgCu)||Issue Date:||13-Apr-2017||Citation:||ARUN KUMAR SESURAJ (2017-04-13). IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING. ScholarBank@NUS Repository.||Abstract:||A ferromagnetic material being incorporated into the Sn rich solder material has the potential to act as a magnetic micro-seed, thereby on application of AC magnetic field, it will create sufficient heat to melt the solder by localized induction heating. In this work, the incorporation of ferromagnetic Fe into the SAC305 solder material is achieved through the low-temperature mechanical alloying process by varying two ball milling speed operating conditions such as 250 and 350rpm. The impact of Fe on the morphology, properties, and distribution in the SAC305 solder is investigated through well -known characterization techniques such as XRD, SEM-EDX, DSC, and VSM. As a solder material 350rpm ball milled Fe-SAC305 is recommended for precision centric magnetic induction heating applicability, whereas as solder joint 250rpm ball milled Fe-SAC305 is better as the Fe remains in its elemental form and has a high potential for induction heating application.||URI:||http://scholarbank.nus.edu.sg/handle/10635/136799|
|Appears in Collections:||Master's Theses (Open)|
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