Please use this identifier to cite or link to this item:
|Title:||Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges||Authors:||Yin, W.-Y.
|Issue Date:||2005||Citation:||Yin, W.-Y.,Dong, X.T.,Mao, J. (2005). Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/APMC.2005.1606428||Abstract:||Various finite-ground thin-film microstrip interconnects (TFMIs) used in the design of high-speed circuit, monolithic microwave and millimeter-wave integrated circuits are studied and compared. Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground TFMIs on Benzocyclobutene (BCB), polyimide and LTCC films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. © 2005 IEEE.||Source Title:||Asia-Pacific Microwave Conference Proceedings, APMC||URI:||http://scholarbank.nus.edu.sg/handle/10635/116080||ISBN:||078039433X||DOI:||10.1109/APMC.2005.1606428|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 11, 2020
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.