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Title: Design of packaged microstrip antennas using wirebonding technique
Authors: Dou, W.
Chia, Y.W.M. 
Issue Date: Nov-2002
Citation: Dou, W., Chia, Y.W.M. (2002-11). Design of packaged microstrip antennas using wirebonding technique. International Journal of Electronics 89 (11) : 833-843. ScholarBank@NUS Repository.
Abstract: A wirebonding technique is exploited to design novel miniature packaged antennas. Wirebond is readily used in manufacturing facilities for mass production of electronic components. Hence we have extended it to fabricate small antennas with a package for low cost mass consumption. Two new designs of small packaged antennas have been developed for the ISM band centred at about 2.45 GHz. The first design is a multilayer microstrip structure and the second design is a single-layer C-shaped structure with a novel proximal feed configuration to improve the impedance matching for thin microstrip antennas. The antennas feature 3.0-4.4% bandwidths, measuring 9.8% × 9.8% to about 10.9% × 10.9% of wavelength in length and width. Parametric studies are performed to investigate the performance of these antennas. The effects of finite ground, bondwires and isolated pads as well as package lids on the antenna performance have been evaluated.
Source Title: International Journal of Electronics
ISSN: 00207217
DOI: 10.1080/0020721031000118806
Appears in Collections:Staff Publications

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