Please use this identifier to cite or link to this item: https://doi.org/10.1109/TDMR.2004.826387
Title: Expanded Papers From the 2003 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Authors: Pey, K.L.
Radhakrishnan, M.K. 
Trigg, A.
Issue Date: Mar-2004
Citation: Pey, K.L., Radhakrishnan, M.K., Trigg, A. (2004-03). Expanded Papers From the 2003 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE Transactions on Device and Materials Reliability 4 (1) : 4-. ScholarBank@NUS Repository. https://doi.org/10.1109/TDMR.2004.826387
Source Title: IEEE Transactions on Device and Materials Reliability
URI: http://scholarbank.nus.edu.sg/handle/10635/115420
ISSN: 15304388
DOI: 10.1109/TDMR.2004.826387
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