Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/115364
Title: A new breakdown failure mechanism in HfO 2 gate dielectric
Authors: Ranjan, R.
Pey, K.L.
Tang, L.J.
Tung, C.H.
Groeseneken, G.
Radhakrishnan, M.K. 
Kaczer, B.
Degraeve, R.
De Gendt, S.
Keywords: Breakdown
Dielectric-breakdown- induced epitaxy
HfO 2
High-k gate dielectrics
Issue Date: 2004
Citation: Ranjan, R.,Pey, K.L.,Tang, L.J.,Tung, C.H.,Groeseneken, G.,Radhakrishnan, M.K.,Kaczer, B.,Degraeve, R.,De Gendt, S. (2004). A new breakdown failure mechanism in HfO 2 gate dielectric. Annual Proceedings - Reliability Physics (Symposium) : 347-352. ScholarBank@NUS Repository.
Abstract: The breakdown failure mechanism in HfO 2 high-k gate dielectrics under constant voltage stress in inversion and accumulation mode is physically analyzed with the aid of high resolution transmission electron microscopy. The results show that the breakdown phenomenon in HfO 2 gate dielectrics is different from that of ultrathin SiO xN y and Si 3N 4 gate dielectrics. Dielectricbreakdown-induced epitaxy, which is the failure defect responsible for breakdown in SiO xN y and Si 3N 4 has also been observed in HfO 2 but in a slightly different morphology. The microstructural damages observed in the breakdown of HfO 2 gate dielectrics are probably related to HfSi x and HfSiO x formation during BD event.
Source Title: Annual Proceedings - Reliability Physics (Symposium)
URI: http://scholarbank.nus.edu.sg/handle/10635/115364
ISSN: 00999512
Appears in Collections:Staff Publications

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