Please use this identifier to cite or link to this item:
|Title:||Study of Cu diffusion in Cu/Tan/SiO2/Si multilayer structures||Authors:||Zhang, D.H.
|Issue Date:||2001||Citation:||Zhang, D.H.,Loh, S.W.,Li, C.Y.,Foo, P.D.,Xie, J.,Liu, R.,Wee, A.T.S.,Zhang, L.,Lee, Y.K. (2001). Study of Cu diffusion in Cu/Tan/SiO2/Si multilayer structures. Surface Review and Letters 8 (5) : 527-532. ScholarBank@NUS Repository. https://doi.org/10.1016/S0218-625X(01)00127-0||Abstract:||This paper reports the effect of a flash copper layer, sandwiched between a copper film deposited by metal-organic chemical vapor deposition (MOCVD) and a TaN barrier metal, on copper diffusion through TaN barrier to Si substrate after rapid thermal annealing at different temperatures. It is found that for the structure of CVD Cu/TaN/SiO2/Si, which has no flash Cu layer, Cu could diffuse through the 25-nm-thick TaN barrier layer at an annealing temperature of 600°C for 180 s. However, by incorporating a flash Cu layer between the CVD Cu film and the TaN barrier, Cu diffusion can be significantly reduced. In addition to Cu, the out-diffusion of Si and oxygen, and the interaction between them can also be reduced by the incorporated flash Cu layer, due likely to the change of the crystallographic orientation of the CVD Cu films.||Source Title:||Surface Review and Letters||URI:||http://scholarbank.nus.edu.sg/handle/10635/113105||ISSN:||0218625X||DOI:||10.1016/S0218-625X(01)00127-0|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Sep 10, 2019
checked on Sep 6, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.