Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/112973
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dc.titleStructures, properties and responses to heat treatment of melt-spun Cu - Y alloys
dc.contributor.authorLi, Y.
dc.contributor.authorNg, S.C.
dc.contributor.authorTan, L.K.
dc.contributor.authorLu, D.
dc.date.accessioned2014-11-28T08:12:52Z
dc.date.available2014-11-28T08:12:52Z
dc.date.issued1997-08-22
dc.identifier.citationLi, Y.,Ng, S.C.,Tan, L.K.,Lu, D. (1997-08-22). Structures, properties and responses to heat treatment of melt-spun Cu - Y alloys. Journal of Alloys and Compounds 259 (1-2) : 276-282. ScholarBank@NUS Repository.
dc.identifier.issn09258388
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/112973
dc.description.abstractCopper alloys containing up to 7 wt.% Y were prepared by chill-block melt-spinning into ribbons of thickness between 40 to 70 μm. The melt-spun ribbons were heat treated for 2 h at 200, 300, 400, 500, 600 and 800 °C respectively. The as-spun and heat treated ribbons were tested for microhardness and resistivity. The microstructures of these ribbons were investigated by optical and transmission electron microscopy and X-ray diffraction. Microstructures were of the typical Zone A/Zone B type for Cu - 3Y, Cu - 4Y and Cu - 7Y ribbons as-spun and of columnar cell type for Cu - 1Y ribbons as-spun. X-ray diffraction and TEM confirm that on the chill side of the ribbon there were nano-sized αCu with only a small amount of secondary phases. These nano-sized αCu were retained partially after heat treatment up to 600 °C for 2h for Cu - 3Y, Cu - 4Y and Cu - 7Y alloys. The secondary phases were identified by TEM and XRD as Cu4Y/Cu5Y. Both αCu and Cu4Y/Cu5Y coarsened as a result of heat treatment at 800 °C for 2 h for all the alloys. © 1997 Elsevier Science S.A. © 1997 Elsevier Science S.A.
dc.sourceScopus
dc.subjectHeat treatment
dc.subjectNanocrystalline alloys
dc.subjectRapid solidification
dc.subjectYttrium copper alloys
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.contributor.departmentMATERIALS SCIENCE
dc.description.sourcetitleJournal of Alloys and Compounds
dc.description.volume259
dc.description.issue1-2
dc.description.page276-282
dc.description.codenJALCE
dc.identifier.isiutNOT_IN_WOS
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