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|Title:||Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process||Authors:||Lu, H.
|Issue Date:||Sep-2002||Citation:||Lu, H., Kang, C.L., Wong, S.C.K., Gong, H. (2002-09). Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process. Semiconductor Science and Technology 17 (9) : 911-917. ScholarBank@NUS Repository. https://doi.org/10.1088/0268-1242/17/9/302||Abstract:||Several commercial electroless nickel chemicals were evaluated with a low cost wafer bumping process. In this paper we describe some physical and electric properties of the nickel bumps built up by these commercial electroless nickel chemicals. Finally, a commercial chemical was suggested for the low cost wafer bumping process.||Source Title:||Semiconductor Science and Technology||URI:||http://scholarbank.nus.edu.sg/handle/10635/107031||ISSN:||02681242||DOI:||10.1088/0268-1242/17/9/302|
|Appears in Collections:||Staff Publications|
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