Please use this identifier to cite or link to this item: https://doi.org/10.1007/BF02657724
DC FieldValue
dc.titleCorrelation between intermetallic thickness and roughness during solder reflow
dc.contributor.authorZuruzi, A.S.
dc.contributor.authorLahiri, S.K.
dc.contributor.authorBurman, P.
dc.contributor.authorSiow, K.S.
dc.date.accessioned2014-10-28T05:11:05Z
dc.date.available2014-10-28T05:11:05Z
dc.date.issued2001-08
dc.identifier.citationZuruzi, A.S., Lahiri, S.K., Burman, P., Siow, K.S. (2001-08). Correlation between intermetallic thickness and roughness during solder reflow. Journal of Electronic Materials 30 (8) : 997-1000. ScholarBank@NUS Repository. https://doi.org/10.1007/BF02657724
dc.identifier.issn03615235
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/105075
dc.description.abstractThe evolution of Cu-Sn and Ni-Sn intermetallic compound (IM) morphologies during isochronal reflow of a PbSn solder with Cu and electroless-Ni was investigated. The root mean square roughness of the Cu-Sn and Ni-Sn IM layers exhibited a linear dependence on average thickness, with gradients () of 0.33 and 0.65, respectively. The difference in values was attributed to different thickness distributions resulting from morphological dissimilarity of the IM layers. The apparent activation energies for growth and roughness evolution of both IM were found to be similar and suggest that both IM thickness and roughness evolution are controlled by the same mechanism. © 2001 TMS-The Minerals, Metals and Materials Society.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1007/BF02657724
dc.sourceScopus
dc.subjectIntermetallic
dc.subjectroughness
dc.subjectsolders
dc.typeArticle
dc.contributor.departmentSTATISTICS & APPLIED PROBABILITY
dc.description.doi10.1007/BF02657724
dc.description.sourcetitleJournal of Electronic Materials
dc.description.volume30
dc.description.issue8
dc.description.page997-1000
dc.description.codenJECMA
dc.identifier.isiut000170458500016
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

15
checked on Dec 3, 2022

WEB OF SCIENCETM
Citations

13
checked on Nov 24, 2022

Page view(s)

165
checked on Nov 24, 2022

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.