Development of stretch solder interconnections for wafer level packaging
Rajoo, R. Lim, S.S. Wong, E.H. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R.
Rajoo, R.
Lim, S.S.
Wong, E.H.
Hnin, W.Y.
Seah, S.K.W.
Iyer, M.
Tummala, R.R.
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Alternative Title
Abstract
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps. © 2008 IEEE.
Keywords
Hourglass interconnect, Solder joint reliability, Stretch solder interconnect, Temperature cycling, Wafer level packaging
Source Title
IEEE Transactions on Advanced Packaging
Publisher
Series/Report No.
Collections
Rights
Date
2008-05
DOI
10.1109/TADVP.2008.923390
Type
Article