Novel electrical performance analysis for leaded packages
Jin, Z. Ma, J. Iyer, M.K. Ooi, B.L. Leong, M.S.
Jin, Z.
Ma, J.
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Abstract
This paper presents a novel analysis of electrical performance in 208PQFP. S-parameters are used to model the package leads. Simultaneous switching noise (SSN) is analysed both in time and frequency domain. Higher frequency effects, such as resonance and reflection are also included in this simulation study.
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Source Title
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
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Date
1998
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Conference Paper