1. ScholarBank@NUS

Voon Yew Thean

rp31809

Collaboration Map View Statistics Email Alert RSS Feed

Publications

Refined By:
Department:  DEAN'S OFFICE (COLLEGE OF DESIGN & ENG)

Results 1-20 of 34 (Search time: 0.019 seconds).

Issue DateTitleAuthor(s)
115-May-20222.5D-MoS2-Based Non-Volatile Optical Memory for Integrated PhotonicsXu Zefeng; Baoshan Tang ; LEONG JIN FENG ; Evgeny Zamburg ; Voon Yew Thean 
213-Apr-202023.2 A 70µW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB TransceiverLUO YUXUAN ; LI YIDA ; THEAN VOON YEW, AARON ; HENG CHUN HUAT 
32019A Compact Model for 2-D Poly-MoS2 FETs With Resistive Switching in Postsynaptic SimulationWang, L. ; Wang, L.; Ang, K.-W. ; Thean, A.V.-Y. ; Liang, G. 
41-Dec-2019A fully-printed flexible MoS2 memristive artificial synapse with femto joules switching energyTHEAN VOON YEW, AARON 
515-Jan-2020A highly sensitive graphene oxide based label-free capacitive aptasensor for vanilin detectionTHEAN VOON YEW, AARON 
621-Jun-2022A Simulation Approach to Analyze Bridge-Defects in a 6T-SRAM Bit CellJoydeep Ghosh ; Shang Yi Lim; Ferdaus Md. Meftahul; Senthilnath Jayavelu; Aaron Voon-Yew Thean 
714-Jun-2019A statistical Seebeck coefficient model based on percolation theory in two-dimensional disordered systemsTHEAN VOON YEW, AARON 
82020A Stretchable‐Hybrid Low‐Power Monolithic ECG Patch with Microfluidic Liquid‐Metal Interconnects and Stretchable Carbon‐Black Nanocomposite Electrodes for Wearable Heart MonitoringTHEAN VOON YEW, AARON 
92018A surface potential based compact model for two-dimensional field effect transistors with disorders induced transition behaviorsTHEAN VOON YEW, AARON 
1020-Jul-2020A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-Based Gesture Recognition With AI at the EdgeLUO YUXUAN ; LI YIDA ; THAM CHEN KHONG ; HENG CHUN HUAT ; THEAN VOON YEW, AARON 
115-Nov-2019An 8.2- μ W 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital ConverterLUO YUXUAN ; LI YIDA ; THEAN VOON YEW, AARON ; HENG CHUN HUAT 
1220-Apr-2022Anneal-Free HZO-Based Ferroelectric Field-Effect Transistor for Back-End-of- Line-Compatible Monolithic 3D IntegrationTsai Shih-Hao; Chun-Kuei Chen; WANG XINGHUA ; UMESH CHAND ; SONU DEVI; Evgeny Zamburg ; THEAN VOON YEW, AARON 
132018Bendable and Stretchable Microfluidic Liquid Metal-Based FilterTHEAN VOON YEW, AARON 
148-Nov-2021Bridge-Defect Prediction in SRAM Circuits Using Random Forest, XGBoost, and LightGBM LearnersJoydeep Ghosh ; Shang Yi Lim; Aaron Voon-Yew Thean 
156-May-2022Engineered Nucleotide Chemicapacitive Microsensor Array Augmented with Physics-Guided Machine Learning for High-Throughput Screening of CannabidiolYap, Stephanie Hui Kit ; Pan, Jieming ; Dao, Viet Linh ; Zhang, Xiangyu ; Wang, Xinghua ; Teo, Wei Zhe ; Zamburg, Evgeny ; Tham, Chen-Khong ; Yew, Wen Shan ; Poh, Chueh Loo ; Thean, Aaron Voon-Yew 
166-Mar-2022Extremely- Scaled Channel Thickness ZnO FET with High Mobility 86 cm2/V-s, Low SS of 83mV/dec and Low Thermal Budget Process (<300°C)Umesh Chand ; Chen Chun-Kuei; Manohar Lal ; Sonu Hooda; Hasita Veluri; Zihang Fang; Shih-Hao Tsai; Aaron Voon-Yew Thean 
1711-Oct-2022First Demonstration of Ultra-low Dit Top-Gated Ferroelectric Oxide-Semiconductor Memtransistor with Record Performance by Channel Defect Self-Compensation Effect for BEOL-Compatible Non-Volatile Logic SwitchChun-Kuei Chen; Zihang Fang; Sonu Hooda; Manohar Lal ; Umesh Chand ; Zefeng Xu; Jieming Pan ; Shih-Hao Tsai; Evgeny Zamburg ; Aaron Voon-Yew Thean 
182019Highly Scaled Strained Silicon-On-Insulator Technology for the 5G Era: Impact of Geometry and Annealing on Strain Retention and Device Performance of nMOSFETsTHEAN VOON YEW, AARON 
192-Nov-2021Hybrid-Flexible Bimodal Sensing Wearable Glove System for Complex Hand Gesture RecognitionJieming Pan ; Yida Li ; Yuxuan Luo ; Xiangyu Zhang ; Xinghua Wang ; David Liang Tai Wong ; Chun-Huat Heng ; Chen-Khong Tham ; Aaron Voon-Yew Thean 
2012-Aug-2022Non-destructive online seal integrity inspection utilizing autoencoder-based electrical capacitance tomography for product packaging assuranceJIEMING PAN ; Zaifeng Yang; THEAN VOON YEW, AARON ; STEPHANIE HUI KIT YAP ; ZHANG XIANGYU ; Li Yida ; LUO YUXUAN ; Evgeny Zamburg ; Tham Chen Khong ; En-Xiao Liu; Zefeng Xu