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Lee Kwok Hong

rp08659

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Profile

Full Name
Lee Kwok Hong
(not current staff)
Variants
Lee, K.-H.
Lee, K.H.
 
Main Affiliation
 
Faculty
 
Email
engleekh@nus.edu.sg
 

Publications

Refined By:
Author:  Lim, K.M.

Results 1-11 of 11 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
17-Oct-2004A fast algorithm for three-dimensional electrostatics analysis: Fast Fourier Transform on Multipoles (FFTM)Ong, E.T.; Lee, K.H. ; Lim, K.M. 
220-Nov-2003A fast algorithm for three-dimensional potential fields calculation: Fast Fourier Transform on MultipolesOng, E.T.; Lim, K.M. ; Lee, K.H. ; Lee, H.P.
3Jan-2005A new variable-order singular boundary element for calculating stress intensity factors in three-dimensional elasticity problemsZhou, W.; Lim, K.M. ; Lee, K.H. ; Tay, A.A.O. 
430-Sep-2002A new variable-order singular boundary element for two-dimensional stress analysisLim, K.M. ; Lee, K.H. ; Tay, A.A.O. ; Zhou, W.
5Nov-2006Advances in vapor pressure modeling for electronic packagingWong, E.H.; Koh, S.W.; Lee, K.H. ; Lim, K.-M. ; Lim, T.B.; Mai, Y.-W.
61998Analysis of delamination in IC packages using a new variable-order singular boundary elementTay, A.A.O. ; Lee, K.H. ; Lim, K.M. 
71998Boundary element analysis of delamination in IC packagesTay, A.A.O. ; Lee, K.H. ; Lim, K.M. 
82001Determining the most likely site and mode of thermomechanical failure in multi-material systemsTay, A.A.O. ; Lee, K.H. ; Zhou, W.; Lim, K.M. 
9Dec-2003Numerical simulation of delamination in IC packages using a new variable-order singular boundary elementTay, A.A.O. ; Lee, K.H. ; Lim, K.M. 
102001Predicting failure sites and failure modes in an IC package using a variable order boundary element methodTay, A.A.O. ; Lee, K.H. ; Zhou, W.; Lim, K.M. 
11May-2003Singular elements for electro-mechanical coupling analysis of micro-devicesOng, E.T.; Lee, K.H. ; Lim, K.M.