Wu, Jianhua

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Full Name

Wu, Jianhua

Variants

Wu, J.H.
Wu, J.

Main Affiliation

INSTITUTE OF MICROELECTRONICS

Faculty

NON-NUS ORGANISATIONS

Refined By:

Author: Lim, T.B.

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		Issue Date	Title	Author(s)
	1	Mar-1995	Wirebond deformation during molding of IC packages	Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.
	2	1993	Wirebound deformation during molding of IC packages	Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.