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Wu, Jianhua

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Full Name
Wu, Jianhua
Variants
Wu, J.H.
Wu, J.
 
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Faculty
 

Publications

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Type:  Article
Department:  MECHANICAL ENGINEERING

Results 1-3 of 3 (Search time: 0.004 seconds).

Issue DateTitleAuthor(s)
12000Effect of delamination on the thermal fatigue of solder joints in flip chipsOng, E.T.; Tay, A.A.O. ; Wu, J.H. 
2Feb-1995Effect of wirebond geometry and die setting on wire sweepTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
3Mar-1995Wirebond deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.